Commercial connectors for high speed data transmission were tested in order to evaluate the degradation rate of contact resistance due to stress relaxation and corrosion. Moreover thermal ageing, thermal humidity test, corrosive attack and mechanical stresses have been applied and contact resistance constantly monitored.

M., C., Mugnaini, M., R., S. (2000). Effects of test sequences on the degradation analysis in high speed connectors. MICROELECTRONICS RELIABILITY, 40(8-10), 1461-1465 [10.1016/S0026-2714(00)00150-5].

Effects of test sequences on the degradation analysis in high speed connectors

MUGNAINI, MARCO;
2000-01-01

Abstract

Commercial connectors for high speed data transmission were tested in order to evaluate the degradation rate of contact resistance due to stress relaxation and corrosion. Moreover thermal ageing, thermal humidity test, corrosive attack and mechanical stresses have been applied and contact resistance constantly monitored.
2000
M., C., Mugnaini, M., R., S. (2000). Effects of test sequences on the degradation analysis in high speed connectors. MICROELECTRONICS RELIABILITY, 40(8-10), 1461-1465 [10.1016/S0026-2714(00)00150-5].
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11365/11249
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